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Email: uwamic@mailplus.wisc.edu

Paul F. Nealey
Phone: 608.265.8171

Juan dePablo
Phone: 608.262.7727

Jon J. McCarthy
Development Director
Phone: 608.263.1073

Sheri Severson
Consortium Administrator
Phone: 608.265.3783

University of Wisconsin-Madison

What is UWAMIC?

The Advanced Materials Industrial Consortium gives commercial partners the opportunity to collaborate with students and faculty in advanced materials research across the UW–Madison campus. The consortium facilitates interaction with university resources through a wide range of paths, including:

UWAMIC Membership Levels and Benefits

Companies may join UWAMIC at any of the following membership levels:

Sustaining Membership

(includes a seat on the Industrial Advisory Board)

General Membership

Collaborative Membership
(requires active collaboration with a UW group or facility)

Small Business Membership
(fewer than 10 employees)

Startup Company
(fewer than 5 employees)


Key member benefits include:

Research Programs and Facilities

Member organizations are provided access to shared UW-Madison research facilities at a discount for a time period dependent upon the membership level. Shared research facilities are available at these internationally recognized research and education centers:


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Ian Robertson, Donald B. Willett professor of engineering at the University of Illinois and director of the National Science Foundation Division of Materials Research, has been selected as the new dean of the College of Engineering at the University of Wisconsin–Madison. [FULL ARTICLE]
Professor Dietram A. Scheufele and Professor Thomas F. Kuech were recently added by American Association for the Advancement of Science into its rolls of elected fellows. This honor was given to professor Scheufele due to his distinguished contributions to the field of science communication. Professor Keuch was given this honor because of his outstanding research in the field of solid state materials synthesis and characterization. [FULL ARTICLE]
Thrust 2 has used the predictable, three-dimensional side chain patterns generated by β-peptides with single-molecule force spectroscopy to quantify how changes in nanometer-scale chemical patterns affect intermolecular interactions, with a particular focus on understanding hydrophobic interactions. In addition, and significantly, Thrust 2 used their findings to enable additional exciting discoveries regarding the way in which proximal charged groups influence hydrophobic interactions. Overall, these experiments performed by Thrust 2 elucidate two influences of proximal cationic groups on hydrophobic interactions, and broadly validate an experimental system that has the potential to substantially advance our understanding of intermolecular forces associated with hydrophobic domains on the molecular length scale.
Imec announces the successful implementation of Self-Assembly (DSA) process line all-under-one-roof in academic lab-scale DSA process flow to fab-compatible Directed Self-Assembly (DSA) process line all-under-one-roof in Imec’s 300mm cleanroom fab. The upgrade of an academic lab-scale DSA process flow to a fab-comparable flow was realized in collaboration with the University of Wisconsin, AZ Electronic Materials and Tokyo Beccron Ltd. Imec’s DSA collaboration aims to address the critical hurdles to take DSA from the academic lab-scale environment into high volume manufacturing.
Recent research by Thrust 3 has demonstrated that the interactions that arise between nanoparticles suspended in a liquid crystal can be manipulated over multiple orders of magnitude (ranging from 1 to 100 kBT) through control of the particles’ surface chemistry and their radius. Previous work with micron sized particles had established that particle-particle interactions are extremely strong and essentially irreversible. The Thrust’s results are significant in that they demonstrate that interactions between nanoparticles are fundamentally different from those between micro-particles, and they can in principle be controlled to yield reversible, equilibrium assemblies for potential applications in devices.